Products
Intelligent solution for lamination Ultra-fine circuit solution Semiconductor packaging substrate electroplating solution Advanced semiconductor packaging solutions
Contact free Vertical Deveoping Line
Contact free Vertical Deveoping Line
  • - Non‑contact vertical production
  • - Compatible with ultra‑fine circuits
  • - Automatic loading / unloading system
  • - Special frame design (anti‑warping, adjustable dimension)
  • - Cleanliness management (magnetic drive wheels, secondary filtration, etc.)
  • - Easy maintenance & servicing
  • - Automatic bath makeup & tank‑cleaning function
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Contact free Vertical DF Stripping Linbe Line
Contact free Vertical DF Stripping Linbe Line
  • - Non‑contact vertical‑type production    
  • - Compatible with ultra‑fine circuits
  • - Automatic loading / unloading system
  • - Special frame design (anti‑warping, adjustable dimensions)
  • - Cleanliness management (magnetic drive wheels, secondary filtration, etc.)
  • - Easy maintenance and servicing
  • - Automatic dry‑film residue filtration system
  • - Automatic bath makeup and tank‑cleaning function
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Contact free Vertical Flash Etching Line
Contact free Vertical Flash Etching Line
  • -Non‑contact vertical‑type production 
  • - Compatible with ultra‑fine circuits
  • - Automatic loading / unloading system
  • - Special frame design (anti‑warping, adjustable dimensions)
  • - Cleanliness management (magnetic drive wheels, secondary filtration, etc.)
  • - Easy maintenance and servicing
  • - Automatic bath makeup and tank‑cleaning function
  • - High uniformity
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Point Contact VerticalChemical Treatment Line
Point Contact VerticalChemical Treatment Line
  •  - Production by point‑contact vertical method  - no puddle effect, minimal undercut, excellent hole‑developing capability  
  • - Excellent uniformity on front and back sides
  • - Fully‑automatic loading & unloading system
  • - Reduce defects including scratches, reverse sticking and roller marks on workpieces
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