Products
Intelligent solution for lamination Ultra-fine circuit solution Semiconductor packaging substrate electroplating solution Advanced semiconductor packaging solutions
SAP/Msap VCP Patterning and Cu Filling Plating Line
SAP/Msap VCP Patterning and Cu Filling Plating Line
  •  - Non‑contact fully‑automatic loading & unloading system  
  •  - Special tension hanger
  • - Function for abnormal‑hanger detection and removal
  • - Segmented anode technology 
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Gantry Surface Finisheing Line
Gantry Surface Finisheing Line
  • - Non‑contact fully‑automatic loading & unloading system      
  • - Special tension hanger
  • - Function for abnormal‑hanger detection and removal
  • - Segmented anode technology 
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Gantry Plating Line
Gantry Plating Line
  • Non-contact fully automatic loading/unloading system
  • Panel warping prevention technology
  • Automatic variable baffle device
  • Potion withdrawal reduction technology
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