Products
Intelligent solution for lamination Ultra-fine circuit solution Semiconductor packaging substrate electroplating solution Advanced semiconductor packaging solutions
Full Automatice Layup and Reflow System
Full Automatice Layup and Reflow System
  • - Systematic and high‑efficiency automatic board stacking
  • - Enables combined processing of core boards, PP prepregs, copper foils, SUS sheets and buffer pads
  • - Greatly reduces manpower; high‑quality production achieved with elaborate FM design
  • - Comprehensive error proofing  detection system covering thickness, weight, layer count and other parameters
  • - Equipped with intelligent control system
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Copper Foil punching and cuting all in one Machine
Copper Foil punching and cuting all in one Machine
  • ‑ Integrated copper foil punching and cutting. Replaces two separate machines, saving floor space and lowering risks of manual handling
  • ‑induced contamination in intermediate processes.                                                                
  •   ‑ Servo‑driven die adjustment for punching specification change, minimizing manual positioning errors. 
  •  ‑ Dual‑process synchronization enables simultaneous punching and cutting operations.                                                                    
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　CCD Alignment Induction Bonding Machine
　CCD Alignment Induction Bonding Machine
  • Adopting automatic CCD alignment, no alignment holes need to be fabricated for inner‑layer core boards and PP prepregs, which greatly saves manpower and process steps. The built‑in CCD and UVW mechanism of the equipment perform automatic alignment for inner‑layer core boards to meet the high alignment accuracy requirements of the PCB laminating process.
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Pin Alignment Induction Bonding Machine
Pin Alignment Induction Bonding Machine
  •  - Equipped with an electromagnetic generator with built‑in PID control technology and Hangtaiji hot‑melt heads, which can perform autonomous temperature control according to the preset target temperature.                                                     
  • - Multi‑stage temperature control design ensures uniform resin flow and excellent bonding strength.
  • - The pressure of hot‑melt heads can be automatically adjusted corresponding to different temperature‑control stages.
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