Vacuum Laminator
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Vacuum Laminator
It is primarily used for ultra-fine circuit sputtering on semiconductor substrates, interposers, and TGV, ABF fine circuits.
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Product Advantages
 
  • Product Advantages:                                                                                   
  • - Suitable for vacuum lamination of Dry‑film, ABF and DFSR                                                               
  • - Excellent thermal uniformity and precise temperature control                                                          
  •  - Innovative new vacuum system to minimize micro‑voids