Sputtering Machine
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Sputtering Machine
It is mainly used for sputtering of ultra‑fine circuits on semiconductor substrates, interposers, TGV and ABF fine‑line structures.
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Product Advantages
 
  • Product Advantages:                                                                                   
  • - Special fixture transport                                                        
  •  - High‑efficiency production for double‑sided sputtering                                                        
  •  - Servo‑controlled precision low‑speed bidirectional transmission system                                                          
  • - Ti coating thickness: 50‑400 nm; Cu coating thickness: 200‑1000 nm                                                      
  • - Custom multi‑target design, independent operation control, matched with sputtering rates for different metals