Full Automatice Layup and Reflow System
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Full Automatice Layup and Reflow System
The equipment is used for automatic planning and overlay, reflow transportation, automatic disassembly, and wiring of ICS, MSAP, HDI, and high-multi-layer products, achieving a high degree of automation in lamination.
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Product Advantages
 

  • Product Advantages：

    - Systematic and high‑efficiency automatic board stacking
    - Enables combined processing of core boards, PP prepregs, copper foils, SUS sheets and buffer pads
    - Greatly reduces manpower; high‑quality production achieved with elaborate FM design
    - Comprehensive error proofing  detection system covering thickness, weight, layer count and other parameters
    - Equipped with intelligent control system