Solder Ball Inspection Machine
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Solder Ball Inspection Machine
Primarily applied in the backend of FCBGA, it is used for the C4 area of products such as IN-TRAYFCBGA
Conduct bump size and appearance inspection.
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Product Advantages
 
  • Product Advantages:                                                                                     
  •  - Compatible with inspection of round and flat bumps                                    
  • - High‑throughput production capability                                   
  • - Simultaneous 3D & 2D data inspection                                               
  • - Multiple defect classification channels