SAP/Msap VCP Patterning and Cu Filling Plating Line
Home - Semiconductor packaging substrate electroplating solution
SAP/Msap VCP Patterning and Cu Filling Plating Line
FCBGA/FCCSP/ETS/MSAP/Anylayer/HDI等 ※填孔，图形，全板，脉冲电镀线等。
Contact
Product Advantages
 
  • Product Advantages:                                                                               
  •  - Non‑contact fully‑automatic loading & unloading system                                                          
  •   - Special tension hanger
  • - Function for abnormal‑hanger detection and removal
  • - Segmented anode technology