CCD Alignment Induction Bonding Machine
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　CCD Alignment Induction Bonding Machine
Adopting automatic CCD alignment, no alignment holes need to be fabricated for inner‑layer core boards and PP prepregs, which greatly saves manpower and process steps. The built‑in CCD and UVW mechanism of the equipment perform automatic alignment for inner‑layer core boards to meet the high alignment accuracy requirements of the PCB laminating process.
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Product Advantages
  • ‑ No punching is required for inner‑layer boards, which completely eliminates accuracy errors caused by punching and improves inter‑layer alignment precision.                                                             
  •  ‑ It fully avoids inner‑layer alignment errors resulting from the dimensional difference between alignment reference holes and alignment pin diameters.                                                             
  •  ‑ Since inner‑layer boards require no punching, surface scratches caused by friction during board transportation and punching can be reduced.                                                                      
  • ‑ Automatic stacking and alignment of inner‑layer boards and PP prepregs can be achieved. Combined with an automatic board unloader, full automation of the bonding process is realized.