Products
Intelligent solution for lamination Ultra-fine circuit solution Semiconductor packaging substrate electroplating solution Advanced semiconductor packaging solutions
Gold Finger Beveler
Gold Finger Beveler
  • - User‑friendly Touch panel with customizable operation, easy to learn
  • - Integrated sliding universal suction cup for fully‑automatic loading and unloading
  • - Automatic high‑precision positioning by CCD camera, effectively eliminating processing defects caused by forming tolerance
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Solder Ball Inspection Machine
Solder Ball Inspection Machine
  •  - Compatible with inspection of round and flat bumps                                    
  • - High‑throughput production capability                                   
  • - Simultaneous 3D & 2D data inspection                                               
  • - Multiple defect classification channels
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