Products
Intelligent solution for lamination Ultra-fine circuit solution Semiconductor packaging substrate electroplating solution Advanced semiconductor packaging solutions
Inline Plasma
Inline Plasma
  • - Enables automated inline production  
  • - Adopts compact chamber design for optimal plasma performance
  • - Custom power generator to tailor production parameters for diverse product specifications
  • - Supports Class 100 cleanroom compliance per customer requirements
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Bumping Inspection Machine
Bumping Inspection Machine
  • - Industry‑latest solution compatible with Mega JEDEC trays (387*380 & 258*538)    
  •  - Minimum bump size: 18 μm
  • - Capable of inspecting up to 4 million bumps per single unit
  • - Supports inspection of product thickness variation (BTV / CTV, Intel‑qualified)
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Sputtering Machine
Sputtering Machine
  • Special fixture conveyor
  • High-efficiency production of double-sided sputtering
  • Servo precision low-speed bidirectional transmission system
  • Ti:50-400nm,Cu:200-1000nm
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Vacuum Laminator
Vacuum Laminator
  • - Suitable for vacuum lamination of Dry‑film, ABF and DFSR
  •  - Excellent thermal uniformity and precise temperature control
  •  - Innovative new vacuum system to minimize micro‑voids
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